Semicon China: AI, advanced packaging set to drive country’s chip industry growth
SCMP Tech / 3/25/2026
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Key Points
- Semicon China’s organizers say China is on track to account for nearly half of global wafer capacity within two years, signaling continued expansion of the country’s chip manufacturing base.
- The event highlights AI as a key demand driver for the semiconductor industry, linking AI growth to chip production and utilization.
- Advanced packaging is positioned as a major technology lever for growth, reflecting industry focus on how next-gen packaging can improve performance and scaling beyond traditional chip-making steps.
- The overall message is that AI plus advanced packaging will help accelerate China’s semiconductor industry development as the market and manufacturing capacity expand.
Agentic artificial intelligence and advanced packaging technology will be key growth drivers for China’s chip industry in coming years, as the country is expected to increase its share of chipmaking capacity to nearly half of the world’s total by 2028.
According to data revealed at Semicon China, the world’s largest chip industry trade show, China’s share of wafer fabrication capacity for mainstream processes was expected to reach 42 per cent of global capacity by 2028.
That would mark a rapid...
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